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Description Chemicals Epoxy, Heat Cure, Underfill, 30CC/30ml Syringe,
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Description Chemicals Epoxy, Heat Cure, Assembly, BiPax, C Tube, 1.280
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Description Chemicals Solvent, Room Temp Cure, Conformal Coating, Pint
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Description Chemicals Low CTE, Low Moisture Sensitivity, Epoxy, Encaps
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Description Chemicals Epoxy, Heat Cure, Assembly, Other Package Types,
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Description Chemicals Conductive Dry Film Product, 20 Per Roll, LOCTIT
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Description Chemicals Hybrid Chemistry, Silver Filled, Die Attach, CDF
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Description Chemicals Epoxy, Reflow Cure, Underfill, 30ml EFD Syringe,
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Description Chemicals Die Attach Adhesive, 3CC, Ablestik 84-1LMI
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